3.00 Credits
This course will cover in detail the processing steps used in modifying material properties in nanofabrication. An intensive study of metals used in nanotechnology aids the student in understanding the various methods of metalization such as CVD, evaporation, and sputtering. Metal applications for interconnect technologies will be examined. Aluminum, refactory metals and copper deposition techniques and characterization will be discussed in detail along with topics such as diffusion barriers, contact resistance, electromigration, corrosion, stress effects, and adhesion. Other modification technologies such as ion implementation, diffusion and surface preparation and treatment are integrated as well. An intensive study of dielectric properties and materials including dielectric constant engineering, mechanical, optical, and electrical characteristics, poly, BSG, PSG, SOG, and BPSG gives the student further insight into advanced device fabrication. Material properties and basic device structures will be discussed for the optoelectronic market.Upon completion of this course, students should be able to: Contrast thermally grown oxides with spin on dielectrics. Identify the processing equipment for slicing, etching and polishing. Describe the procedures for slicing, etching, polishing, and epitaxial growth. Perform advanced fabrication techniques. Determine the processing parameters of dielectric materials. Explain the concept of engineering dielectric constants for different nanofabrication applications. Explain metalization techniques and processing equipment. Select appropriate materials to match the design needs of nanofabricated devices. Describe the process of direct bandgap photonic emission. Examine common materials and properties for the optoelectronic market. Describe the need for optoelectronic devices.
Prerequisite:
Prerequisite: TEL 260 and TEL 261 and TEL 262 and TEL 263.