3.00 Credits
This course will examine a variety of techniques and measurements essential for controlling device fabrication and final packaging. Monitoring techniques such as residual gas analysis (RGA), optical emission spectroscopy (OES) and end point detection will be discussed. Characterization techniques such as SEM, XPS/Auger, surface profilometry, advanced optical microscopy, optical thin film measurements, ellipsometry and resistivity/conductivity to yield analysis and process control will also be stressed. These will include breakdown measurements, junction testing, C-V and I-V tests and simple transistor characterization. In addition, we will examine mechanical as well as electrical characteristics of some simple MEMs devices and chemical and biological responses of nanofabricated biomedical structures. The student will also learn about the manufacturing issues involved in subjects such as interconnects, isolation and final device assembly. Aluminum, refractory metals and copper deposition techniques and characterization will be discussed in detail along with topics such as diffusion barriers, contact resistance, electromigration, corrosion, stress effects and adhesion. The importance of planarization techniques such as deposition/etchback and chemical/mechanical polishing will be emphasized. Lastly, packaging procedures such as die separation, inspection bonding, sealing and final test for both conventional ICs and novel MEM and biomedical devices will be examined.