3.00 Credits
Examines a variety of techniques and measurements essential for controlling device fabrication and final packaging. Monitoring techniques such as residual gas analysis (RGA), optical emission spectroscopy (OES) and end point detection will be discussed. Characterization techniques such as: SEM, XPS/Auger, surface profilometry, advanced optical microscopy, optical thin film measurements, ellipsometry, and resistivity/conductivity measurements will be used on real samples. Basic electrical measurements on device structures for yield analysis and process control will also be stressed. These will include breakdown measurements, junction testings, and C-V and I-V tests and simple transistor characterization. In addition, we will examine mechanical as well electrical characteristics of some simple MEMs devices and chemical and biological responses of nanofabricated biomedical structures. The student will also learn about the manufacturing issues involved in subjects such as interconnects, isolation, and final device assembly. Aluminum, refractory metals and copper depositon techniques and characterization will be discussed in detail along with topics such as diffusion barriers, contact resistance, electromigration, corrosion, stress effects, and adhesion. The importance of planarization techniques such as depostion/etchback adn chemical/mechanical polishing will be emphasized. Lastly, packaging procedures such as die separation, inspection bonding, sealing and final test for both conventional IC's and novel MEM and biomedical devices will be examined.