3.00 Credits
This course examines a variety of measurements and techniques essential for controlling micro- and nanofabrication processes. Monitoring techniques such as residual gas analysis (RGA), optical emission spectroscopy (OES) and end point detection are discussed. Characterization techniques such as scanning electron microscopy x-ray photoelectron spectroscopy, atomic probe methods advanced optical microscopy, optical thin film measurements, ellipsometry, and resistivity/conductivity measurements are introduced and tied to process control. Basic measurements for yield analysis and process control are also stressed. These include breakdown measurements, junction testing, and capacitance-voltage and current voltage characterization. In addition, the characteristics of some simple bio-chip structures and MEMs devices are obtained and discussed. The student learns about the manufacturing issues involved in interconnects, materials compatibility and final device assembly. Aluminum, refractory metals and plastic fabrication techniques and characterization are discussed in detail along with topics such as diffusion barriers, contact resistance, electro migration, corrosion, and adhesion. The importance of planarization techniques such as deposition/etchback and chemical/mechanical polishing are emphasized. Lastly, procedures such as die separation, bonding, and sealing and final test for both conventional Cs and MEMs and biomedical devices are examined.